Sees Co., Ltd. has filed a patent for blockchain application technologies that miniaturize blockchain into a chip, making it applicable across a wide range of IoT fields, and has commenced the development of the Blockchain Chip.
At the same time, the company has launched its new Blockchain IoT Business.
By using this Blockchain Chip, it will be possible to apply blockchain to various sensors, robots, and other devices, thereby enabling the construction of secure IoT systems powered by blockchain.
Looking ahead, Sees Co., Ltd. plans to advance development step by step, aiming to complete an evaluation system within 2020 and to finalize the SIP (System-in-Package) by 2023, with sales to follow.
Sees HP
