The Blockchain Chip patent filed by Sees Co., Ltd. was registered on September 28, 2021.
The Sees Blockchain Chip, which lies at the core of our blockchain IoT business, is something we proudly believe will revolutionize IoT.
By not only ensuring the reliability of transmitted data but also enabling autonomous decentralized control of edge devices, it makes it possible to construct large-scale IoT systems unlike anything seen before.
To realize this Blockchain Chip, Sees Co., Ltd. has successfully developed an extremely compact light node blockchain. Moving forward, we will focus our efforts on developing the SIP (System-in-Package) to house it.
By decentralizing edge processing in IoT through the Blockchain Chip, we will also make possible a decentralized AI system, in which each chip functions like a single brain cell.
This is the IoT chip of the next generation--the Sees Blockchain Chip.
Sees Blockchain Chip
