The patent for blockchain chips applied for by Sees Co., Ltd. was registered in Japan as of September 28, 2021, and has now become a registered patent in China as of March 25, 2024.
We are proud that the Sees Blockchain Chip, the core of our blockchain IoT business, is revolutionizing the IoT.
By not only guaranteeing the transmission of data, but also by enabling autonomous decentralized control of terminal devices, it is possible to construct large-scale IoT systems that have never been seen before.
Sees Co., Ltd. has successfully developed an extremely compact light node blockchain for the purpose of realizing this blockchain chip, and is also developing a dedicated Linux platform.
We will focus on developing a chip (SIP) to accommodate this.
By autonomously decentralizing terminal processing in the IoT with blockchain chips, distributed AI can be realized by replacing the chip with a single brain cell.
The next generation of IoT chips, that is the Sees Blockchain Chip.
Sees Blockchain Chip
